Consider a 10-in × 11.5-in epoxy glass laminate (k = 0.10 btu/h⋅ft⋅°f) whose thickness is 0.05 in. in order to reduce the thermal resistance across its thickness, cylindrical copper fillings (k = 223 btu/h⋅ft⋅°f) of 0.02 in diameter are to be planted throughout the board, with a center-to-center distance of 0.06 in. determine the new value of the thermal resistance of the epoxy board for heat conduction across its thickness as a result of this modification.