The heat generated in the circuitry on the surface of a silicon chip (k=130 w/m°c) is conducted to the ceramic substrate to which it is attached. the chip is 6 mm × 6 mm in size and 0.5 mm thick and dissipates 3 w of power. disregarding any heat transfer through the 0.5 mm high side surfaces, determine the temperature difference between the front and back surfaces of the chip in steady operation.