An aluminum plate of 25 mm thick (k 5 235 W/m·K) is attached on a copper plate with thickness of 10 mm. The copper plate is heated electrically to dissipate a uniform
heat flux of 5300 W/m2

. The upper surface of the aluminum plate is exposed to convection
heat transfer in a condition such that the convection heat transfer coefficient is 67 W/m2
·K
and the surrounding room temperature is 20°C. Other surfaces of the two attached plates
are insulated such that heat only dissipates through the upper surface of the aluminum
plate. If the surface of the copper plate that is attached to the aluminum plate has a
temperature of 100°C, determine the thermal contact conductance of the aluminum/copper
interface.