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Engineering, 30.03.2020 17:17 Rock3422

A square (12.5 mm × 12.5 mm) silicon chip is insulated on one side and cooled on the opposite side by atmospheric air in parallel flow at [infinity] 20 m/s and [infinity] 24°C. When in use, electrical power dissipation within the chip maintains a uniform heat flux at the cooled surface. Assume the critical Reynolds number is 5x105.

(a) If the chip temperature may not exceed 80°C at any point on its surface, what is the maximum allowable power?
(b) What is the maximum allowable power if the chip is flush mounted in a substrate that provides for an unheated starting length of 20 mm?

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