There is a 2mm gap between computer chips and heat sinks in the system. the temperatures of the chips and heat sinks are maintained at 400k and 300k, respectively. there is air between the gap with a temperature of 300k and heat transfer coefficient of 20 w/m2k. in this case, which heat transfer mode is dominant? explain your answer.

air properties: p=1.225kg/m3, u=1.8x10-5 ns/m2, kair = 0.02 w/mk.
heat sink and heat source: ksolid = 100w/mk, varepsilon =0.5 (for all surfaces)