Engineering, 13.12.2019 18:31 msjbryant33
One integrated circuit design calls for the diffusion of arsenic into silicon wafers; the background concentration of as in si is 2.5 × 1020 atoms/m3. the predeposition heat treatment is to be conducted at 1000°c for 45 minutes, with a constant surface concentration of 8 × 1026 as atoms/m3. at a drive-in temperature of 1100°c, determine the diffusion time required for a junction depth of 1.2 μm. for this system, values of qd and d0 are 4.10 ev and 2.29 × 10−3 m2/s, respectively.
Answers: 2
Engineering, 04.07.2019 18:10
Adouble-strand no. 60 roller chain is used to transmit power between a 13-tooth driving sprocket rotating at 300 rev/min and a 52-tooth driven sprocket. a) what is the allowable horsepower of this drive? b) estimate the center-to-center distance if the chain length is 82 pitches. c) estimate the torque and bending force on the driving shaft by the chain if the actual horsepower transmitted is 30 percent less than the corrected (allowable) power.
Answers: 3
Engineering, 04.07.2019 18:10
The thermal expansion or contraction of a given metal is a function of the f a)-density b)-initial temperature c)- temperature difference d)- linear coefficient of thermal expansion e)- final temperature f)- original length
Answers: 2
Engineering, 04.07.2019 18:10
You are making beer. the first step is filling the glass carboy with the liquid wort. the internal diameter of the carboy is 15 in., and you wish to fill it up to a depth of 2 ft. if your wort is drawn from the kettle using a siphon process that flows at 3 gpm, how long will it take to fill?
Answers: 1
Engineering, 04.07.2019 18:10
Ifa component is made of two or more materials with different modulus of elasticity (e), it is called a composite member and we calculate the factor·n". mention the formula for calculating n". also, ifn> 1, explain what will happen to the 1. transformed.gi) ifn 1, what will happen to the material when transformed material when
Answers: 1
One integrated circuit design calls for the diffusion of arsenic into silicon wafers; the backgroun...
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