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Engineering, 18.11.2019 23:31 maddiemccarter3892

In fracas failure trend analysis, match these findings with their probable root cause (some may be used more than once, and some may not be used): different components from the same vendor fail in different applications. design issue. b. manufacturing workmanship or process issue. isame component, possibly from different vendors, fails, but in the same location (on a circuit card, for example). c. wearout issue a component seems to fail, but when the component is removed and tested, it tests ok dvendor process or vendor quality issue. failure only happens during certain conditions (such as environmental)

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