Aluminum diffuses readily into silicon. for transistors with shallow source-drain regions, annealing frequently causes aluminum to diffuse through the source-drain region and short to the substrate. this problem, called "junction spiking," can be combated through the use of a thin titanium-tungsten (tiw) barrier between the aluminum and silicon. how might such a barrier affect device performance? (hint: read the section on contact resistance in the device analysis lab.)

Amass of m 1.5 kg of steam is contained in a closed rigid container. initially the pressure and temperature of the steam are: p 1.5 mpa and t 240°c (superheated state), respectively. then the temperature drops to t2= 100°c as the result of heat transfer to the surroundings. determine: a) quality of the steam at the end of the process, b) heat transfer with the surroundings. for: p1.5 mpa and t 240°c: enthalpy of superheated vapour is 2900 kj/kg, specific volume of superheated vapour is 0. 1483 m/kg, while for t 100°c: enthalpy of saturated liquid water is 419kj/kg, specific volume of saturated liquid water is 0.001043m/kg, enthalpy of saturated vapour is 2676 kj/kg, specific volume of saturated vapour is 1.672 m/kg and pressure is 0.1 mpa.

Acompressor receives the shaft work to decrease the pressure of the fluid. a)- true b)- false

Calculate the bore of a cylinder that has a stroke of 18 inches and an extension time of 6 seconds at a flow rate of 4 gal/min.