Engineering, 26.09.2019 23:30 abelinoperez652
Show that: cp=vtα(∂p/∂t)s, n, where α is the coefficient of thermal expansion.
Answers: 3
Engineering, 04.07.2019 18:20
Ahe-xe mixture containing a 0.75 mole fraction of helium is used for cooling electronics in an avionics application. at a temperature of 300 k and atmospheric pressure, calculate the mass fraction of helium and the mass density, molar concentration and molecular weight of the mixture. if the cooling capacity is 10 l, what is the mass of the coolant?
Answers: 3
Engineering, 04.07.2019 19:10
With increases in magnification, which of the following occur? a. the field of view decreases. b. the ambient illumination decreases. c. the larger parts can be measured. d. the eyepiece must be raised.
Answers: 1
Engineering, 06.07.2019 02:30
Air (c-1.006 kj/kg.k, r-0.287 kj/kg.k) enters a nozzle steadily at 280 kpa and 77°c with a velocity of 50 m/s and exits at 85 kpa and 320 m/s. the heat losses from the nozzle to the surrounding medium at 20°c are estimated to be 3.2 kj/kg. determine (a) the exit temperature and (b) the total entropy change for this process. solve this problem using constant specific heats.
Answers: 1
Engineering, 06.07.2019 02:30
1in2 processor chip can be modelled as an isothermal plane wall of silicon, isothermal on both sides. the power input to the bottom of the plane wall, or the processing power of the chip, often called the thermal design power (tdp), is 100w. assume the periphery is adiabatic. the silicon is 400 microns thick. the temperature at the junction, or in this case on the bottom of the isothermal plane wall, is 85°c. what is the top surface temperature, assuming that the only mode of heat transfer is conduction
Answers: 1
Show that: cp=vtα(∂p/∂t)s, n, where α is the coefficient of thermal expansion....
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