subject
Engineering, 18.09.2019 00:00 tatipop49

Ahomeowner in new mexico needs to replace her existing air source heat pump, which is only used to provide heating. her choice is to replace it with either a 2020 high-efficiency air source heat pump, or with a 2020 high-efficiency ground source heat pump. which one would you recommend? assume the existing heat pump is equivalent to the 2009 installed base, and take the heating load as 36,000 btu/h, 14 h/day, 5 months/year.

ansver
Answers: 3

Another question on Engineering

question
Engineering, 04.07.2019 18:10
Air is to be cooled in the evaporator section of a refrigerator by passing it over a bank of 0.8-cm-outer-diameter and 0.4-m-long tubes inside which the refrigerant is evaporating at -20°c. air approaches the tube bank in the normal direction at 0°c and 1 atm with a mean velocity of 4 m/s. the tubes are arranged in-line with longitudinal and transverse pitches of sl- st 1.5 cm. there are 30 rows in the flow direction with 15 tubes in each row. determine (a) the refrigeration capacity of this system and (b) pressure drop across the tube bank. evaluate the air properties at an assumed mean temperature of -5°c and 1 atm. is this a good assumption?
Answers: 1
question
Engineering, 04.07.2019 19:20
To save energy, the air supply to a 2000 ft office has been shut off overnight and the room temperature has dropped to 40°f. in the morning, the thermostat is reset to 70°f and warm air at 120 f begins to flov in at 200ft'/min. the air is well mixed within the room, and an equal mass flow of air at room temperature (changing with time) is withdrawn through a return duct. the air pressure is nearly 1 atm everywhere. ignoring heat transfer with the surroundings and kinetic and potential energy effects, estimate how long it takes for the room temperature to reach 70°f. plot the room temperature as a function of time.
Answers: 1
question
Engineering, 06.07.2019 02:30
1in2 processor chip can be modelled as an isothermal plane wall of silicon, isothermal on both sides. the power input to the bottom of the plane wall, or the processing power of the chip, often called the thermal design power (tdp), is 100w. assume the periphery is adiabatic. the silicon is 400 microns thick. the temperature at the junction, or in this case on the bottom of the isothermal plane wall, is 85°c. what is the top surface temperature, assuming that the only mode of heat transfer is conduction
Answers: 1
question
Engineering, 06.07.2019 04:10
Aspherical thermocouple measurement errors a spherical thermocouple made of constantin transfer coefficient between the gas and the thermocouple is h used to measure the temperature of a gas. the heat 400 w/m2 k. calculate the maximum diameter d of the thermocouple if the thermocouple's measurement error should be w 23 within 5% of the initial temperature difference in 5 seconds. for constantin, k 8920 kg/m3, and c 410 j/kg. k.
Answers: 3
You know the right answer?
Ahomeowner in new mexico needs to replace her existing air source heat pump, which is only used to p...
Questions
Questions on the website: 13722367