Chemistry, 13.12.2020 08:50 dmurdock1973

Help would be appreciated-- 15 pts! Can someone describe deposition technology to me and why its significant?

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There is a very large number and wide variation of deposition techniques. There is no unique method to classify these techniques. Depending on the viewpoint, the same process may fall into one or more classes. Each technique has its advantages and disadvantages. The choice of technique will depend on the various selection criteria, specific application, and available resources. More than one technique can be used to deposit a given thin film material. Hybrid techniques are becoming more widely used and available. Thin film deposition technology and the science have progressed rapidly in the direction of engineered thin film coatings and surface engineering. Thin films with new properties are deposited with new deposition processes such as atomic layer deposition (ALD), high-power pulsed magnetron sputtering (HPPMS), mid-frequency/dual magnetron sputtering (MF/DMS) and glancing angle of incidence deposition (GLAD). Advanced thin film deposition processes have been developed and new technologies have been adapted to conventional deposition processes. Thin film is the general term used for coatings that are used to modify and increase the functionality of a bulk surface or substrate. They are used to protect surfaces from wear, improve lubricity, improve corrosion and chemical resistance, and provide a barrier to gas penetration. Engineered materials are the future of thin film technology. Organic materials are also playing a much more important role in many types of coating structures and applications. Advanced deposition technologies are particularly successful in furthering medical and energy technologies, including thin film solar cells, thin film fuel cells (solid oxide fuel cells), biomedical products, and tribological applications.

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Answerthe half-reaction having the greatest tendency to occur at the anode: i₂(aq) + 2e⁻ ⇄ 2i⁻ ; e = +0.53 v====== $\begin{aligned} \text{i}_2\text{\footnotesize (aq)}+2\,\text{e}^{-} & \rightleftharpoons 2\,\text{i}^{-}\text{\footnotesize (aq)}& \text{e} & = +0.53\text{ v} \\ \text{co}^{3+}\text{\footnotesize (aq)} + \text{e}^{-} & \rightleftharpoons \text{co}^{2+}\text{\footnotesize (aq)} & \text{e} & = +1.80\text{ v} \\ \text{o}_2\text{\footnotesize (g)}+4\,\text{h}^{+}\text{\footnotesize (aq)} + 4\,\text{e}^{-} & \rightleftharpoons 2\,\text{h}_2\text{o}\text{\footnotesize(l)}& \text{e} & = +1.23\text{ v} \\ \end{aligned}$ oxidation occurs at the anode. we must therefore find the half-reaction with the greatest tendency to oxidize.the given values of e are reduction potentials (the form of the half-reactions are of reduction).the lower the reduction potential, the higher the potential to oxidize. the half-cell with the lowest reduction potential will have the greatest tendency to oxidize at the anode.the half-reaction having the greatest tendency must be i₂(aq) + 2e⁻ ⇄ 2i⁻ e = +0.53 vbecause its reduction potential is the lowest out of the three.

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Help would be appreciated-- 15 pts! Can someone describe deposition technology to me and why its si...

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